doc. no : qw0905-la16b/ugc-pf rev. : a date : 22 - jun. - 2006 data sheet ligitek electronics co.,ltd. property of ligitek only led array la16b/ugc-pf pb lead-free parts
18.0min lug2643-1-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 25.0min 2.54typ 1.0min + - 0.5 typ 3.1 2.9 4.3 3.3 1.5max + - 1.0min 2.54typ package dimensions part no. la16b/ugc-pf 7.4 5.08 0.5 typ 2.0 0.5 3.5 4.6 6.5 page 1/5 ligitek electronics co.,ltd. property of ligitek only
2/5 page ligitek electronics co.,ltd. property of ligitek only unit ma ma mw ratings 30 ug symbol i f 120 100 i fp pd -40 ~ +85 -40 ~ +100 t opr tstg 22040 typ. 20 2.6 20 1.7 max. min. color 574 water clear lens 120 min. viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length dnm spectral halfwidth nm forward voltage @ ma(v) ir10 a parameter forward current peak forward current duty 1/10@10khz power dissipation operating temperature storage temperature material algainp part no la16b/ugc-pf reverse current @5v absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. green emitted electrostatic discharge esd 2000 v static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. la16b/ugc-pf
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 0.5 550600650 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -40 0.8 -20 1.1 1.0 0.9 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 20 060 40100 80 100 20 ambient temperature( ) -20 -40 060 4080 typical electro-optical characteristics curve 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 1.0 10 ug chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 2.03.0 1000 forward current(ma) 1.010100 4.05.0 page3/5 part no. la16b/ugc-pf
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 60 seconds max 25 0 0 2 /sec max preheat 50 time(sec) 100 150 120 260 temp( c) 260 c3sec max 5 /sec max page 4/5 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only part no. la16b/ugc-pf
this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec solderability test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solder resistance test thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test reliability test: test itemtest condition mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard page 5/5 part no. la16b/ugc-pf
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